Semiconductor device

ABSTRACT

The yield of a semiconductor device is improved which has a large-scale logic circuit or which has both a logic circuit and a memory. A basic circuit block is provided with an input/output circuit. A transmission line and a branch line connect the input/output circuits so that information can be exchanged through the input/output circuits between one basic circuit block and another basic circuit block. The memory in each basic circuit block or in each input/output circuit can be programmed from the outside to designate the destination of a signal. By thus changing the program in the memory, the transmission destination of a signal can be changed to give various functions efficiently with a limited circuit scale. Moreover, if a basic circuit block fails another basic circuit block substitutes for it to improve the yield drastically.

This application is the national phase under 35 U.S.C. § 371 of PCTInternational Application No. PCT/JP02/01184 which has an Internationalfiling date of Feb. 13, 2002, which designated the United States ofAmerica.

TECHNICAL FIELD

The present invention relates to a semiconductor device, and inparticular, to a semiconductor integrated circuit that executescommunications between a plurality of basic circuit blocks, which areformed on one substrate and provided with input/output circuits.

BACKGROUND ART

LSI's (large-scale integrated circuits) have drastically improvedintegration with improvements in fine processing techniques. With theimproved integration, the scales of the logic circuits mounted on LSI'shave become significantly increased and made to have high functions.Moreover, by virtue of the system-on-chip technology by which the logiccircuits of a microprocessor, an ASIC (application specific integratedcircuit) and so on and various memory circuits are mounted together onone semiconductor substrate, various electronic apparatuses have beenfurther developed in terms of high functions and downsizing.

In a conventional LSI, the role of each circuit is fixed. That is, eachbasic circuit executes only a specified basic operation, and advancedfunctions are attained by combining a number of these basic circuits.Moreover, the communication channels of information between the basiccircuits are determined in the design stage and connections are providedby fixed interconnections.

FIG. 7A shows a signal flow in a conventional LSI. The signal isdetermined to flow sequentially from A→B→C→D with regard to the circuitblocks A through D as the aforementioned basic circuits, and the rolesof the circuit blocks A through D are fixed.

However, since the signal is determined to flow sequentially fromA→B→C→D and the roles of the circuit blocks A through D are fixed in theabove-mentioned conventional LSI as shown in FIG. 7A, there are thefollowing problems.

That is, if a part of the circuit (for example, the circuit block B)fails as shown in FIG. 7B, then the signal is not transmitted to thecircuit blocks subsequent to the circuit block B, and the functions ofthe whole circuit mounted on the LSI are to be lost. Accordingly, thereis a problem that the entire LSI becomes defective even when only onebasic circuit (circuit block) fails, and if the logic circuit has alarge scale or mounted together with different kinds of elements, theyield of LSI's is reduced.

Moreover, according to the conventional LSI technologies, if, forexample, a signal is transmitted parallel from the circuit block A toall of the circuit blocks B, C and D in FIG. 7A, it is required toconnect the circuit block A to each of the circuit blocks B, C and D bymutually independent interconnections. There is also a problem that, ifthe interconnections are miniaturized and complicated, then theparasitic capacitances between the interconnections increase, reducingthe operating speed.

Therefore, the object of the present invention is to provide asemiconductor device with a good yield even when the device has a largescale or comprises the logic circuits, memories and so on mountedtogether.

SUMMARY OF THE INVENTION

In order to achieve the above object, there is provided a semiconductordevice comprising:

-   -   a plurality of basic circuit blocks which are formed on an        identical semiconductor substrate and constructed of a logic        circuit or a memory circuit or a circuit of a combination of a        logic circuit and a memory circuit;    -   input/output circuits which are formed on the semiconductor        substrate and provided for the plurality of basic circuit blocks        and execute transmission and reception of information between        the corresponding basic circuit block and another basic circuit        block;    -   transmission means which are connected to each of the        input/output circuits and transmit a signal representing the        information from the input/output circuit to another        input/output circuit; and    -   transmission destination information storage means which is        provided for either one of the basic circuit block and the        input/output circuit and in which transmission destination        information of the information are written or erased from        outside.

According to the above-mentioned construction, the basic circuit blocksprovided with the input/output circuits are formed on one semiconductorsubstrate. The transmission destination information is written from theoutside into one destination information storage means of either one ofthe basic circuit block and the input/output circuit, and the signalthat represents the information from the basic circuit block istransmitted via the transmission means to another basic circuit blockcorresponding to the transmission destination information by theinput/output circuit. Therefore, by properly setting from the outsidethe transmission destination of the information from the basic circuitblock according to the purpose, an optimum logic circuit is constructedaccording to the contents of the job to be processed.

Furthermore, by changing the transmission destination of the informationfrom the outside, the functions of the entire logic circuit mounted onthe semiconductor substrate can be changed, and various functions can beefficiently possessed with a limited circuit scale. Furthermore, bychanging the transmission destination of the information, it is possibleto put the defective basic circuit block into a dormant state and makeanother basic circuit block substitute for it. Therefore, even if thereare some defects in the basic circuit blocks mounted on thesemiconductor substrate, it is possible to prevent the entire logiccircuit from becoming defective and drastically improve the yield of thesemiconductor devices.

It is to be noted that the term of the input/output circuit mentionedherein has a concept including circuits divided into an output circuitand an input circuit.

In one embodiment of the present invention, the semiconductor devicefurther comprises self-identification information storage means which isprovided for either one of the basic circuit block and the input/outputcircuit and in which self-identification information for identifyingoneself are written or erased from outside.

According to this embodiment, for example, when the defective basiccircuit block is put into the dormant state and the auxiliary basiccircuit block is made to substitute for it, it is proper to merely copythe contents of the transmission destination information storage meansand the self-identification information storage means in the defectivebasic circuit block into the auxiliary basic circuit block andthereafter erase the contents of both the information storage means ofthe defective basic circuit block. Accordingly, there is no need torewrite the contents of the transmission destination information storagemeans in the transmission origin basic circuit block or to preparatorilyset the self-identification information of all the auxiliary basiccircuit blocks, and the transmission route of the information is easilychanged.

In one embodiment of the present invention, at least three of theinput/output circuits share the transmission means, and

-   -   the input/output circuits which share the transmission means        execute transmission and reception of the information by a        communication method according to a multiplex transmission        system.

According to this embodiment, the transmission of the informationbetween the basic circuit blocks that share the transmission means isexecuted without interference by controlling the input/output circuitsthat share the transmission means. Therefore, if the shared transmissionmeans is a metal interconnection or an optical waveguide, then theinterconnection can be drastically simplified. The parasitic capacitancebetween the interconnections is thus reduced, and a reduction in theoperating speed due to the parasitic capacitance is alleviated.

In one embodiment of the present invention, the transmission means areoptical waveguides, and the transmitted signal is a modulated opticalsignal.

According to this embodiment, the modulated optical signal istransmitted via the optical waveguide, and therefore, communications ata speed higher than the transmission of a digital signal via a metalinterconnection become possible, and the problem of the parasiticcapacitance is avoided. It is to be noted that the term of opticalincludes the concept of infrared rays and ultraviolet rays.

In one embodiment of the present invention, the transmission means areantennas, and the transmitted signal is a modulated electromagnetic wavesignal.

According to this embodiment, the modulated electromagnetic wave signalis transmitted by the antenna, and therefore, the problem of theparasitic capacitance occurring in the case of digital signaltransmission via the metal interconnection is avoided. Moreover, ifelectromagnetic waves of a short wavelength are used, high-speedcommunications become possible. Therefore, the transmission speedbetween the basic circuit blocks is increased, and the operating speedof the logic circuit constructed on the semiconductor substrate can beincreased.

In one embodiment of the present invention, the input/output circuitsexecute transmission and reception of the information by a communicationmethod according to time-division multiple access,

-   -   an identification code of the destination basic circuit block is        written as the transmission destination information into the        transmission destination information storage means, and    -   an identification code of the self basic circuit block is        written as the self-identification information into the        self-identification information storage means.

According to this embodiment, multiplex transmission communications canbe achieved by the input/output circuit with a comparatively smallcircuit scale. Moreover, changing the functions of the entire logiccircuit mounted on the semiconductor substrate and stopping thedefective basic circuit block and assigning its function to anotherbasic circuit block are efficiently executed on the basis of theidentification code.

In one embodiment of the present invention, the input/output circuitsexecute transmission and reception of the information by a communicationmethod according to a code-division multiple access system,

-   -   a spreading code of a destination basic circuit block is written        as the transmission destination information into the        transmission destination information storage means, and    -   a spreading code of the self basic circuit block is written as        the self-identification information into the self-identification        information storage means.

According to this embodiment, multiplex transmission communications ofhigh anti-noise capability become possible. Moreover, changing thefunctions of the entire logic circuit mounted on the semiconductorsubstrate and stopping the defective basic circuit block and assigningits function to another basic circuit block are efficiently executed onthe basis of the spreading code.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of a semiconductor device of this invention;

FIG. 2 is a block diagram of a semiconductor device different from thatof FIG. 1;

FIGS. 3A and 3B are views showing a signal flow when the transmissiondestination of the signal from each basic circuit block is madevariable;

FIG. 4 is a block diagram of a semiconductor device different from thoseof FIGS. 1 and 2;

FIG. 5 is a sectional view of a semiconductor device different fromthose of FIGS. 1, 2 and 4;

FIG. 6 is a sectional view of a semiconductor device different fromthose of FIGS. 1, 2, 4 and 5; and

FIGS. 7A and 7B are views showing a signal flow between circuit blocksof a conventional LSI.

DESCRIPTION OF THE INVENTION

This invention will be described in detail below on the basis of theembodiments thereof shown in the drawings.

FIRST EMBODIMENT

FIG. 1 is a block diagram of the semiconductor device SD of the presentembodiment. In the figure, there are basic circuit blocks 1, and each ofthe basic circuit blocks 1 is constructed of a logic circuit, a memorycircuit or a circuit in which a logic circuit, a memory circuit and soon are mounted together. It is to be noted that the basic circuit blocks1 may have same circuit construction or different circuit constructions.

An input/output circuit 2 is provided for each of the basic circuitblocks 1, and the input/output circuits 2 are connected by a commontransmission line 3 and branch lines 4. Then, each of the basic circuitblocks 1 is able to exchange information with other basic circuit blocks1 via the input/output circuits 2. In FIG. 1, information output to theother basic circuit blocks 1 and information input from the other basiccircuit blocks 1 are executed by the input/output circuits 2. As shownin FIG. 2, it is acceptable to provide an output circuit 12 and an inputcircuit 13 for each of basic circuit blocks 11 and execute informationoutput to the other basic circuit blocks 11 via a transmission line 14and branch lines 15 and information input from the other basic circuitsblocks 11 via the transmission line 14 and the branch lines 15separately by the output circuit 12 and the input circuit 13.

The transmission lines 3, 14 and the branch lines 4 and 15 may beprovided by metal interconnections or optical waveguides. When thetransmission lines 3, 14 and the branch lines 4 and 15 are provided byoptical waveguides and information transmission between the input/outputcircuits 2 or information transmission between the output circuits 12and the input circuits 13 is optically executed, it is possible toexecute communications at a speed higher than electrical communications.Furthermore, there is an advantage that the parasitic capacitance, whichposes a problem in the case of metal interconnections, does not occur.

As a system of communications between the basic circuit blocks 1 and 11executed by the input/output circuits 2 or the output circuits 12 andthe input circuits 13, there is, for example, a TDMA system. The TDMAsystem is a system in which the basic circuit blocks 1 and 11 aredivided on the time basis and all the basic circuits blocks 1 and 11execute communications using same frequency. When this system is used,it is required to provide one basic circuit block 1 or 11 that plays therole of managing the entire system. However, the input/output circuits 2or the output circuits 12 and the input circuits 13 can be constructedcomparatively compact.

Moreover, as a system of communications between the basic circuit blocks1 and 11, a CDMA system is also acceptable. The CDMA system is to assignspreading codes to the basic circuit blocks 1 and 11 and convert asignal into a wideband modulation signal through spread modulation bythe spreading code. Then, on the reception side, the received widebandmodulation signal is despread by using the spreading code used duringtransmission, obtaining the original signal. That is, the basic circuitblock 1 or 11 on the transmission side is able to transmit a signal to aspecified basic circuit block 1 or 11 if the signal is subjected tospread modulation by using the spreading code for reception of the basiccircuit block 1 or 11 on the reception side. If this CDMA system isused, the anti-noise capability can be improved.

As a system of communications between the basic circuit blocks 1 and 11,it is also acceptable to otherwise use an FDMA (Frequency DivisionMultiple Access) system, a PSK (Phase Shift Keying) system, an FSK(Frequency Shift Keying) system, an ASK (Amplitude Shift Keying) systemor the like.

If the transmission lines 3 and 14 and the branch lines 4 and 15 aremetal interconnections, then a digital signal or a modulated digitalsignal or a modulated RF (Radio Frequency) signal is transmitted.Moreover, if the transmission lines 3 and 14 and the branch lines 4 and15 are optical waveguides, then modulated light (including infrared raysand ultraviolet rays) is transmitted.

The signal transmission destination of the basic circuit block 1 or 11via the input/output circuit 2 or the output circuit 12 is variable. Inthe above case, as a method for making the signal transmissiondestination variable, there is a method for providing, for example, amemory 8, 18 in each of the basic circuit blocks 1 and 11 or each of theinput/output circuits 2 or each of the output circuits 12 andprogramming the signal transmission destination into this memory fromthe outside of semiconductor device SD.

FIGS. 3A and 3B schematically show a signal flow when the transmissiondestination of the basic circuit block 1 or 11 is made variable. Forexample, by executing programming of basic circuit blocks B and C as thetransmission destination into the memory units of a basic circuit blockA from the outside and executing programming of a basic circuit block Dinto the memory units of the basic circuit blocks B and C, the signalfrom the basic circuit block A can be inputted parallel to the basiccircuit blocks B and C as shown in FIG. 3A. As described above, byproperly setting the information transmission destination according tothe purpose from the outside, an optimum logic circuit can beconstructed according to the contents of a job to be processed.Moreover, the functions of the entire circuit can be changed by theprogramming into the memory units, and a variety of functions can beprovided with a limited circuit scale.

In contrast to this, in the case of the conventional LSI as shown inFIG. 7A, the roles of the circuit blocks A through D are fixed and thesignal flow is also fixed. Therefore, the functions of the entirecircuit are fixed, and it is required to change the circuit design everytime the functions are changed. For the above reasons, there is causedthe case where the circuit scale is increased in comparison with thesemiconductor device of the present embodiment.

Furthermore, in FIGS. 3A and 3B, by rewriting the signal transmissiondestination programmed in the memory of the basic circuit block A fromthe basic circuit block B to a basic circuit block E that has the samefunction as basic circuit block B and programming the memory of thebasic circuit block E such that its signal transmission destination isthe basic circuit block C, it becomes possible to use the basic circuitblock E in place of the basic circuit block B as shown in FIG. 3B. Thatis, if a basic circuit block fails, it is possible to make another basiccircuit block substitute for it. By so doing, the yield can bedrastically improved.

In contrast to this, in the case of the conventional LSI as shown inFIG. 7A, the roles of the circuit blocks A through D are fixed and thesignal flow is also fixed. Therefore, as shown in FIG. 7B, the entirecircuit becomes defective when only one circuit block B fails, and thisleads to a factor of reducing the yield.

In general, if the yield of each divided circuit is P when a certaincircuit is divided by n, then the yield of the certain circuit as awhole becomes P^(n). For example, assuming that there is a circuitdivided into ten basic circuit blocks and the yield of each of the basiccircuit blocks is 90%, then the yield of this entire circuit becomesabout 35%. In contrast to this, assuming that, for example, eleven basiccircuit blocks, each of which has a yield of 90%, are produced and acircuit is required to be constructed by selecting ten out of them, thenthe yield of this circuit becomes as follows. That is, assuming that theyield of each basic circuit block is P (=90%) the probability that theeleven basic circuit blocks are all normal is P¹¹, and the probabilitythat ten basic circuit blocks are normal and one basic circuit block isdefective is ₁₁C₁P¹⁰(1−P)¹. Therefore, when eleven basic circuit blocksare produced, the probability that ten or more out of them are normal isP¹¹+₁₁C₁P¹⁰(1−P)¹. As a result, the yield of this circuit becomes about70%, and the yield can be drastically improved in comparison with thecase where the circuit comprises ten basic circuit blocks.

Moreover, if it is attempted to provide interconnections as shown inFIG. 1 between eight circuit blocks in the conventional LSI, it isrequired to connect one circuit block to each of the other seven circuitblocks by mutually independent transmission lines, and theinterconnections between the circuit blocks become very complicated.However, according to the semiconductor device of the presentembodiment, if the multiplex transmission system (TDMA system, CDMAsystem or FDMA system) is used as a communication system between theinput/output circuits 2 or between the output circuits 12 and the inputcircuits 13, then signals from all the basic circuits block 1 and 11 canbe transmitted without interruption via one transmission line bycontrolling the input/output circuits 2 or the output circuits 12.Therefore, the branch lines 4 and 15 extended from the input/outputcircuits 2 or the output circuits 12 and the transmission lines 3 and 14connected to them are only required to be at least one. Therefore, theinterconnections can be drastically simplified.

It is to be noted that the branch lines extended from the input/outputcircuits 2 or the output circuits 12 and the transmission lines are notall required to be one, and it is acceptable to provide a plurality oflines at need. In the above case, it is possible to increase theeffective transmission speed between the input/output circuits 2 orbetween the output circuits 12 and the input circuits 13. Moreover, asdescribed above, the conventional LSI has a problem that the operatingspeed is reduced due to an increase in the parasitic capacitance betweenthe interconnections in accordance with the miniaturization andcomplication of the interconnections. However, in the semiconductordevice of the present embodiment, the above-mentioned problem can bealleviated by the simplification of the interconnections.

When the TDMA system is used as a communication system between the basiccircuit blocks 1 and 11, identification codes of the basic circuitblocks 1 and 11 or the input/output circuits 2 or the output circuits 12are made rewritable from the outside. Moreover, all the identificationcodes assigned to all the basic circuits block 1 and 11 are stored inthe basic circuit blocks 1 and 11 that play the role of managing theentire system, and therefore, these codes are made rewritable from theoutside. With this arrangement, it becomes easy to change the role ofeach of the basic circuit blocks 1 and 11 and give no role (put theblock into the dormant state). That is, it becomes easy to efficientlychange the functions of the entire circuit by programming or maintainthe functions of the entire circuit by putting the defective basiccircuit block into the dormant state and assigning its function toanother basic circuit block.

Moreover, when the CDMA system is used as a communication system betweenthe basic circuit blocks 1 and 11, a spreading code for transmission anda spreading code for reception in the basic circuit blocks 1 and 11 orthe input/output circuits 2 or the output circuits 12 are maderewritable from the outside. With this arrangement, it becomes easy tochange the role of each of the basic circuit blocks 1 and 11 and give norole (put the block into the dormant state). That is, it is easy toefficiently change the functions of the entire circuit by programming ormaintain the functions of the entire circuit by putting the defectivebasic circuit block into the dormant state and assigning the functionsto another basic circuit block.

As described above, in the semiconductor device of the presentembodiment, the input/output circuit 2 or the output circuit 12 and theinput circuit 13 are provided for each of the basic circuit blocks 1 and11 constructed of a logic circuit, a memory circuit or a circuit inwhich a logic circuit and a memory circuit are mounted together.Moreover, the input/output circuits 2 or the output circuits 12 and theinput circuits 13 are connected by the common transmission lines 3 and14 and the branch lines 4 and 15. Then, the basic circuit blocks 1 and11 exchange information with other basic circuits block 1 and 11 via theinput/output circuits 2 or the output circuits 12. In the above case, bymaking the memory units of the basic circuit blocks 1 and 11 or theinput/output circuits 2 or the output circuits 12 externallyprogrammable with regard to the signal transmission destination andchanging this program, the signal transmission destination is madevariable.

Therefore, an optimum logic circuit can be constructed according to thecontents of the job to be processed. Moreover, the functions of theentire circuit can be changed by the programming into the memory, andtherefore, a variety of functions can be efficiently provided with alimited circuit scale. Furthermore, it is possible to make another basiccircuit block substitute for a certain basic circuit block that isfailing by rewriting the signal transmission destination programmed inthe memory, and the cost can be reduced with drastically improved yield.

As described above, it is acceptable to make the self-identificationinformation for identifying the self basic circuit block (ownidentification code in the case of the TDMA system or own spreading codefor reception in the case of the CDMA system) externally programmableinstead of making the signal transmission destination externallyprogrammable into the memory. The memory in the above case is requiredto be provided in each of the basic circuit blocks 1 and 11 or each ofthe input/output circuits 2 or each of the output circuits 12. In theabove case, by copying the self-identification information of the basiccircuit block that has become defective into the memory of an auxiliarybasic circuit block and thereafter erasing the self-identificationinformation of the basic circuit block that has become defective, theauxiliary basic circuit block can play the role of substituting for thebasic circuit block that has become defective.

In the above case, there is no need to rewrite the transmissiondestination of the originating basic circuit block that has transmittedthe signal to the basic circuit block that has become defective or topreparatorily assign the self-identification information of all theauxiliary basic circuit blocks. Therefore, the signal transmission routecan easily be changed.

In the above case, if the information exchange with the other basiccircuits blocks 1 and 11 is executed by the multiplex transmissionsystem of the TDMA system, the CDMA system or the FDMA system, then thesignals from all the basic circuits blocks 1 and 11 can be transmittedvia one transmission line without interruption by controlling theinput/output circuits 2 or the output circuits 12. Therefore, thetransmission lines 3 and 14 and the branch lines 4 and 15 between theinput/output circuits 2 or the output circuits 12 and the input circuits13 are only required to be at least one, and the interconnections can bedrastically simplified. As a result, the reduction in the operatingspeed can be restrained by alleviating an increase in the parasiticcapacitance between the interconnections caused by the miniaturizationand complication of the interconnections.

Moreover, by constructing the transmission lines 3 and 14 and the branchlines 4 and 15 of optical waveguides, the signal can be transmitted bymodulated light including infrared rays and ultraviolet rays. Therefore,communications at a speed higher than electrical communications becomepossible, and the parasitic capacitance that poses a problem in the caseof metal interconnections can be prevented from occurring.

In the aforementioned embodiment, the information exchange between thebasic circuit blocks 1 and 11 is executed via the transmission lines 3and 14 and the branch lines 4 and 15, which provide connections betweenthe input/output circuits 2 or between the output circuits 12 and theinput circuits 13. However, as shown in FIG. 4, it is also acceptable toremove the above-mentioned transmission lines and execute theinformation exchange between basic circuit blocks 21 by modulatedelectromagnetic waves via input/output circuits 22 and antennas 23. Inthis case, there is an advantage that communications between the basiccircuit blocks 21 can be executed with no interconnection and theparasitic capacitance that poses a problem when the transmission lines 3and 14 and the branch lines 4 and 15 are constructed of metalinterconnections does not occur. The signal transmission destination isprogrammed into memory 28 from the outside of semiconductor device SD.

SECOND EMBODIMENT

FIG. 5 is a sectional view of the semiconductor device of the presentembodiment. The semiconductor device of the present embodiment isobtained by forming the semiconductor device of the first embodiment onone semiconductor substrate. The semiconductor device of the presentembodiment will be described below with reference to FIG. 5.

Basic circuit blocks 31 and input/output circuits 32 are formed on asemiconductor substrate 34. The basic circuit blocks 31 are connectedvia the input/output circuits 32 to a transmission line 33 formed on alayer of insulation film 35 by branch lines 37, and the whole body iscovered with a protective film 36. In this case, the basic circuitblocks 31, the input/output circuits 32, the transmission line 33 andthe branch lines 37 have the same constructions as those of the basiccircuit blocks 1, the input/output circuits 2, the transmission line 3and the branch lines 4 of the first embodiment. It is to be noted thatthe basic circuit blocks 31 and the input/output circuits 32 are assumedto include local interconnections.

The transmission line 33 connected to the input/output circuits 32 isseparated from the basic circuit blocks 31 and the input/output circuits32 by the layer insulation film 35 and formed as an upper layer metalinterconnection. The transmission line 33 is connected to theinput/output circuits 32 by the branch lines 37 through contact holesopened at the layer insulation film 35.

According to the semiconductor device of the present embodiment, asdescribed above in connection with the first embodiment, a variety offunctions can be provided by the circuits with a limited scale, and thecost can be reduced by drastically improving the yield. Moreover, bydrastically simplifying the interconnections, the parasitic capacitancebetween the interconnections can be reduced to allow high-speedoperation to be achieved. Moreover, the semiconductor device of thepresent embodiment has an advantage that it can be formed by using theconventional LSI processing technique.

THIRD EMBODIMENT

FIG. 6 is a sectional view of the semiconductor device of the presentembodiment. The semiconductor device of the present embodiment differsfrom the semiconductor device of the second embodiment in thatcommunications between the basic circuit blocks are executed byelectromagnetic waves. The semiconductor device of the presentembodiment will be described below with reference to FIG. 6.

Basic circuit blocks 41 and input/output circuits 42 are formed on asemiconductor substrate 44. The entire surface of the semiconductorsubstrate 44 is covered with a protective film 45. In this case, thebasic circuit blocks 41 and the input/output circuits 42 have the sameconstructions as those of the basic circuit blocks 1 and theinput/output circuits 2 of the first embodiment. It is to be noted thatthe basic circuit blocks 41 and the input/output circuits 42 are assumedto include local interconnections.

Antennas 43 are formed in positions corresponding to the input/outputcircuits 42 on the protective film 45, and the antennas 43 and theinput/output circuits 42 are connected together by interconnections viacontact holes 46 formed at the protective film 45. Electromagnetic wavesmodulated by a signal from a basic circuit block 41 are transmitted fromthe antenna 43 to another basic circuit block 41 by the input/outputcircuit 42. Moreover, the electromagnetic waves from another basiccircuits block 41 are received by this antenna 43.

According to the semiconductor device of the present embodiment, asdescribed above in connection with the first embodiment, a variety offunctions can be provided by the circuits with a limited scale, and thecost can be reduced by drastically improving the yield. Moreover, due tothe use of electromagnetic waves for communications, the parasiticcapacitance that poses a problem in the case of metal interconnectionsdoes not occur, and high-speed operation can be achieved. Moreover, ifelectromagnetic waves of a short wavelength are used, then high-speedcommunications are easily achieved. Therefore, the transmission speedbetween the basic circuit blocks 41 can be increased, and high-speedoperation can be achieved.

When the electromagnetic waves used has a short wavelength as in thecase of infrared rays, light or the like, it is proper to provideconnections between the input/output circuits 42 by optical waveguidessimilarly to the case of the second embodiment.

The aforementioned second embodiment and the third embodiment aredescribed on the basis of the input/output circuits 32 and 42 providedfor the respective basic circuit blocks 31 and 41. However, thisinvention is not limited to this, and it is also acceptable toindividually provide the output circuits and the input circuits.

INDUSTRIAL APPLICABILITY

This invention is used for a semiconductor integrated circuit thatexecutes communications between a plurality of basic circuit blocksformed on one substrate.

1. A semiconductor device on a single semiconductor substratecomprising: a plurality of basic circuit blocks formed on the singlesemiconductor substrate with each basic circuit block constructed of acombination of a logic circuit and a memory circuit, a part of theplurality of basic circuit blocks being configured to perform a certainfunction that is the same for one another and a p art of the pluralityof basic circuit blocks being configured to perform a certain functionthat is different from one another, with a function that is moreadvanced than that of the certain function performed by any one basiccircuit block being performed by combining a number of the basic circuitblocks together; a plurality of input/output circuits formed on thesingle semiconductor substrate and provided for the plurality of basiccircuit blocks, said input/output circuits executing transmission andreception of information between the corresponding basic circuit blockand another basic circuit block; transmission means connected to each ofthe input/output circuits and transmitting a signal representinginformation from one of the input/output circuits to another of theinput/output circuits; and transmission destination information storagemeans provided for either one of the basic circuit block and theinput/output circuit of each basic circuit block, wherein transmissiondestination information is written to or erased from each transmissiondestination information storage means from outside the semiconductordevice, the transmission destination information is a basic circuitblock destination of the information that is to be transmitted from anyfirst basic circuit block on the single semiconductor substrate to anysecond basic circuit block on the single semiconductor substrate, usingthe input/output circuit provided corresponding to each basic circuitblock, in order to perform the function that is more advanced than thatof the certain function performed by any one basic circuit block, and bychanging the transmission destination information to be written to thetransmission destination information storage means, make the secondbasic circuit block into a dormant state, while making another basiccircuit block performing the same function as that of the second basiccircuit block active, so that the semiconductor device is prevented frombeing stopped due to a defective basic circuit block, or making anotherbasic circuit block performing a different function from that of thesecond basic circuit block active, so that the function of thesemiconductor device is diversified and the yield of the semiconductordevice is improved.
 2. The semiconductor device as claimed in claim 1,further comprising: self-identification information storage meansprovided for either one of the basic circuit block and the input/outputcircuit and in which self-identification information for identifyingoneself are written or erased from outside.
 3. The semiconductor deviceas claimed in claim 1, wherein at least three of the input/outputcircuits share the transmission means, and the input/output circuitswhich share the transmission means execute transmission and reception ofthe information by a communication method according to a multiplextransmission system.
 4. The semiconductor device as claimed in claim 1,wherein the transmission means being metal interconnections, and thetransmitted signal being at least a digital signal, a modulated digitalsignal or a modulated high-frequency signal.
 5. The semiconductor deviceas claimed in claim 1, wherein the transmission means being opticalwaveguides, and the transmitted signal being a modulated optical signal.6. The semiconductor device as claimed in claim 1, wherein thetransmission means being antennas, and the transmitted signal being amodulated electromagnetic wave signal.
 7. The semiconductor device asclaimed in claim 2, wherein the input/output circuits executetransmission and reception of the information by a communication methodaccording to time-division multiple access, an identification code ofthe destination basic circuit block being written as the transmissiondestination information into the transmission destination informationstorage means, and an identification code of a self-identification basiccircuit block being written as the self-identification information intothe self-identification information storage means.
 8. The semiconductordevice as claimed in claim 2, wherein the input/output circuits executetransmission and reception of the information by a communication methodaccording to a code-division multiple access system, a spreading code ofa destination basic circuit block being written as the transmissiondestination information into the transmission destination informationstorage means, and a spreading code of a self-identification basiccircuit block being written as the self-identification information intothe self-identification information storage means.